Advances in Thin-Film Deposition Technologies: From Physical and Chemical Vapor Deposition to Computational Modeling

Principles, Techniques, and Emerging Simulation Strategies for High-Performance Coatings

Authors

  • Moatasim Amer 1Intelligent medical systems Department, College of bioinformatics, University of Information Technology and Communications, Baghdad, Iraq Author
  • Qamar Adnan bioinformatics Department, College of bioinformatics, University of Information Technology and Communications, Baghdad, Iraq Author
  • Fatima Q Al-Rawi Intelligent medical systems Department, College of bioinformatics, University of Information Technology and Communications, Baghdad, Iraq Author
  • Nawar A.Sakran University of Information Technology and Communications, Baghdad, Iraq Author

DOI:

https://doi.org/10.63964/atjb.2026.1.6

Keywords:

coating; chemical vapor deposition; thin film preparation; physical vapor deposition

Abstract

Because of their many uses in microelectronics, optoelectronics, energy systems, biomedical devices, protective coatings, and surface engineering, thin-film deposition technologies are essential to contemporary materials science and engineering. The structural, mechanical, electrical, and optical characteristics of thin films are largely dependent on the choice of a suitable deposition method. The main thin-film deposition techniques, such as molecular beam epitaxy (MBE), chemical vapor deposition (CVD), physical vapor deposition (PVD), and computational simulation techniques, are thoroughly covered in this review.

The operating principles, benefits, drawbacks, and common uses of both traditional and cutting-edge PVD methods—such as thermal evaporation, electron beam evaporation, sputtering, pulsed laser deposition, ion plating, activated reactive evaporation, and ionized cluster beam deposition—are covered in this review. Additionally, it highlights the deposition mechanisms and process features of the major CVD processes, including conventional CVD, plasma-enhanced CVD, and laser-assisted CVD. Additionally, the contribution of molecular beam epitaxy to the production of superior epitaxial thin films is discussed. Furthermore, recent advances in computational modeling are reviewed as useful tools for comprehending film growth mechanisms, optimizing deposition parameters, and enhancing coating performance. These include molecular dynamics, Monte Carlo methods, multiscale modeling, and predictive control techniques.

Lastly, the review highlights the suitability of various materials and industrial applications by contrasting the capabilities of physical, chemical, and simulation-based approaches. For researchers and engineers interested in thin-film deposition technologies and their future development, this work offers a succinct and current reference.

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Published

2026-03-31